Henghui Technology Corporation Limited is a specialized integrated circuit manufacturer focused on the research, development, production, and sale of chip packaging materials. The company’s core operations encompass a vertically integrated value chain, including lead frame production, module packaging, wafer thinning, dicing, and testing. Henghui is notable for its substantial involvement in the smart card sector, producing a diverse range of contact, contactless, and dual-interface module products, as well as gold- and palladium-plated packaging frames. The company’s products are widely used in applications across communication, finance, transportation, identification, IoT, and public security, serving both domestic and international customers. With an emphasis on independent innovation, Henghui holds numerous patents and software copyrights, and its manufacturing facilities meet stringent quality and environmental standards. As a key partner to major security chip design firms, Henghui plays a significant role in advancing China’s integrated circuit localization efforts and holds a leading position in global IC card packaging capacity, contributing to the reliability and security of electronic identification and payment systems worldwide.